The forced air cooling method is mainly related to the ventilation method and the air volume of the fan.

For semiconductor refrigeration, it is even more difficult. Because of the heat generated by the halogen lamp, a high-power semiconductor refrigeration chip is required, which makes the control difficult, and the heat treatment of the light source chamber is also required, which is unacceptable in size. According to the basic principles of thermal design, the availability of the control system must first be ensured. In addition, the thermal control system should be simple and reliable in structure, feasible in process, and economical.

For the light source chamber, the temperature is controlled within the range that the components within it can withstand. The components in the light source have metal parts, bulbs, glass, and the like. The operating temperatures in these devices are all within 80 °C. The use of forced air cooling makes it possible to control the average temperature of the light source indoors below 80 °C. Based on the above analysis, forced air cooling is adopted in the light source room to dissipate heat. This method is simple and reliable.

The forced air cooling method is mainly related to the ventilation mode and the air volume of the fan. The air vent is designed with a large venting vent to ensure smooth ventilation, and the fan is selected by calculating the air volume of the fan. In addition, in order to facilitate heat dissipation, the heat dissipation area of ​​the outdoor surface of the light source is further increased.

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